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Area-Selective Electroless Deposition of Cu for Hybrid Bonding
http://hdl.handle.net/10131/00014109
http://hdl.handle.net/10131/00014109485eb341-bcfe-43b1-a957-9b2e321e7c69
名前 / ファイル | ライセンス | アクション |
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Area-Selective_Electroless_Deposition_of_Cu_for_Hybrid_Bonding.pdf (1.5 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2021-12-02 | |||||
タイトル | ||||||
タイトル | Area-Selective Electroless Deposition of Cu for Hybrid Bonding | |||||
言語 | ||||||
言語 | eng | |||||
キーワード | ||||||
主題 | Bonding, Surface topography, Surface treatment, Annealing, Surfaces, Dielectrics, Chemicals | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Inoue, Fumihiro
× Inoue, Fumihiro× Iacovo, Serena× El-Mekki, Zaid× Kim, Soon-Wook× Struyf, Herbert× Beyne, Eric |
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著者所属 | ||||||
imec: Leuven, BE | ||||||
著者所属 | ||||||
imec: Leuven, BE | ||||||
著者所属 | ||||||
imec: Leuven, BE | ||||||
著者所属 | ||||||
imec: Leuven, BE | ||||||
著者所属 | ||||||
imec: Leuven, BE | ||||||
著者所属 | ||||||
imec: Leuven, BE | ||||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | This letter describes the use of area-selective electroless Cu deposition for topography control of Cu-SiCN hybrid bonding pads. The electroless deposition of Cu allows one to obtain protrusions on hybrid bonding Cu pads without further polishing optimization. A recessed Cu pad after chemical mechanical polishing becomes a protrusion after electroless deposition. This indicates that the electroless Cu film was selectively deposited on Cu, without deposition on the SiCN surface. A void-free Cu-Cu bonding interface was observed after annealing at 350 °C with an electroless Cu layer at the interface. 100% electrical connection was obtained at 1.4- μm pitch where the deposition thickness was on target. | |||||
書誌情報 |
IEEE Electron Device Letters 巻 42, 号 12, p. 1826-1829, 発行日 2021-11-13 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0741-3106 | |||||
書誌レコードID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AA11955066 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | info:doi/10.1109/LED.2021.3124960 | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
出版者 | ||||||
出版者 | IEEE | |||||
関係URI | ||||||
識別子タイプ | DOI | |||||
関連識別子 | https://doi.org/10.1109/LED.2021.3124960 | |||||
関連名称 | https://doi.org/10.1109/LED.2021.3124960 |