{"created":"2023-06-20T15:14:19.597484+00:00","id":11450,"links":{},"metadata":{"_buckets":{"deposit":"ef36814f-17d6-4daa-a489-9deaa9dbbe2f"},"_deposit":{"created_by":3,"id":"11450","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"11450"},"status":"published"},"_oai":{"id":"oai:ynu.repo.nii.ac.jp:00011450","sets":["495:496"]},"author_link":["40528","40526","40530","40529","40525","40527"],"item_2_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2021-11-13","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"12","bibliographicPageEnd":"1829","bibliographicPageStart":"1826","bibliographicVolumeNumber":"42","bibliographic_titles":[{"bibliographic_title":"IEEE Electron Device Letters"}]}]},"item_2_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"This letter describes the use of area-selective electroless Cu deposition for topography control of Cu-SiCN hybrid bonding pads. The electroless deposition of Cu allows one to obtain protrusions on hybrid bonding Cu pads without further polishing optimization. A recessed Cu pad after chemical mechanical polishing becomes a protrusion after electroless deposition. This indicates that the electroless Cu film was selectively deposited on Cu, without deposition on the SiCN surface. A void-free Cu-Cu bonding interface was observed after annealing at 350 °C with an electroless Cu layer at the interface. 100% electrical connection was obtained at 1.4- μm pitch where the deposition thickness was on target.","subitem_description_type":"Abstract"}]},"item_2_publisher_35":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"IEEE"}]},"item_2_relation_13":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"info:doi/10.1109/LED.2021.3124960","subitem_relation_type_select":"DOI"}}]},"item_2_relation_44":{"attribute_name":"関係URI","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"https://doi.org/10.1109/LED.2021.3124960"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1109/LED.2021.3124960","subitem_relation_type_select":"DOI"}}]},"item_2_source_id_11":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11955066","subitem_source_identifier_type":"NCID"}]},"item_2_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0741-3106","subitem_source_identifier_type":"ISSN"}]},"item_2_text_4":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"imec: Leuven, BE"},{"subitem_text_value":"imec: Leuven, BE"},{"subitem_text_value":"imec: Leuven, BE"},{"subitem_text_value":"imec: Leuven, BE"},{"subitem_text_value":"imec: Leuven, BE"},{"subitem_text_value":"imec: Leuven, BE"}]},"item_2_version_type_18":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Inoue, Fumihiro"}],"nameIdentifiers":[{"nameIdentifier":"40525","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"00908303","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://kaken.nii.ac.jp/ja/search/?qm=00908303"}]},{"creatorNames":[{"creatorName":"Iacovo, Serena"}],"nameIdentifiers":[{"nameIdentifier":"40526","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"El-Mekki, Zaid"}],"nameIdentifiers":[{"nameIdentifier":"40527","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kim, Soon-Wook"}],"nameIdentifiers":[{"nameIdentifier":"40528","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Struyf, Herbert"}],"nameIdentifiers":[{"nameIdentifier":"40529","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Beyne, Eric"}],"nameIdentifiers":[{"nameIdentifier":"40530","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2021-12-02"}],"displaytype":"detail","filename":"Area-Selective_Electroless_Deposition_of_Cu_for_Hybrid_Bonding.pdf","filesize":[{"value":"1.5 MB"}],"format":"application/pdf","licensetype":"license_6","mimetype":"application/pdf","url":{"label":"Area-Selective_Electroless_Deposition_of_Cu_for_Hybrid_Bonding.pdf","url":"https://ynu.repo.nii.ac.jp/record/11450/files/Area-Selective_Electroless_Deposition_of_Cu_for_Hybrid_Bonding.pdf"},"version_id":"e03a3e84-06ca-40dd-9eda-faa7b437dee1"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Bonding","subitem_subject_scheme":"Other"},{"subitem_subject":"Surface topography","subitem_subject_scheme":"Other"},{"subitem_subject":"Surface treatment","subitem_subject_scheme":"Other"},{"subitem_subject":"Annealing","subitem_subject_scheme":"Other"},{"subitem_subject":"Surfaces","subitem_subject_scheme":"Other"},{"subitem_subject":"Dielectrics","subitem_subject_scheme":"Other"},{"subitem_subject":"Chemicals","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Area-Selective Electroless Deposition of Cu for Hybrid Bonding","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Area-Selective Electroless Deposition of Cu for Hybrid Bonding"}]},"item_type_id":"2","owner":"3","path":["496"],"pubdate":{"attribute_name":"公開日","attribute_value":"2021-12-02"},"publish_date":"2021-12-02","publish_status":"0","recid":"11450","relation_version_is_last":true,"title":["Area-Selective Electroless Deposition of Cu for Hybrid Bonding"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2023-06-20T17:55:48.794477+00:00"}