@article{oai:ynu.repo.nii.ac.jp:00004242,
 author = {Mukai, Kohki and Kitayama, Shinya and Yoshimura, Toshiya and Maruo, Shoji},
 issue = {4},
 journal = {Japanese Journal of Applied Physics},
 month = {},
 note = {application/pdf, The electroless plating of ferrite and copper onto photopolymerized resin was investigated with the aim of fabricating three-dimensional microstructures. Evaluation by X-ray diffraction and X-ray fluorescence measurements clarified that the materials were successfully plated onto the resin mold by controlling the temperature and pH of the source solution. High-resolution optical microscope observation revealed that the 2-μm-deep pits at the surface were fully plated by the materials, demonstrating the submicron resolution of the microfabrication process. We performed the transcription of three-dimensional structures made of plated copper from a resin mold, and succeeded in the fabrication of a screw. The 40-μm-thick thread was formed accurately.},
 pages = {3232--3235},
 title = {Ferrite and copper electroless plating of photopolymerized resin for micromolding of three-dimensional structures},
 volume = {47},
 year = {2008}
}