@article{oai:ynu.repo.nii.ac.jp:00003931,
 author = {Yamaguchi, S. and Fukuda, S. and Kitagawa, H. and Okamoto, Y. and Kato, T. and Nakatsugawa, Hiroshi},
 journal = {Proceedings of the 27th International Conference on Thermoelectrics (ICT2008) 3-7 August},
 month = {},
 note = {application/pdf, The perfoemance of microprocessor (CPU) is improving in the past 30 years, and it will be continued in this century. The electric power consumption of the CPU is increasing along the improving the performance of the CPU. Therefore, it is important to cool down the CPU. Heat power density is ＄ sim 10 W/cm^{2}＄ in the present CPU, and its values is the same magnitude of the electric heater's. Peltier module (PM) was once used to cool down CPU in late 1990's to early 2000's. However, PM is not used as the common cooler in the present time. There are two reasons not to use the PM for cooling the CPU. One is its electric power consumption of the PM, and it is almost same as the CPU's itself. The other reason is dew drop. The power consumption of the CPU is changing every time by its job, and when its consumption is low, the dew drop was found inside the computer. The PM is operated as ”Qmax operation”because the temperature difference between two sides of the PM is almost zero. Our proposal to use the short lef of Bismuth telluride alloy (BiTe）. If we cut the leg to 1/5 of an usual PM, the value of ”Qmax”is increased 50% and the electric power consumption of the PM is 1/5.This is one of the solution to cool down the CPU. BiTe is an usual material to make the PM, however we usually use the material f high thermal conductivity to spread the heat flux.Therefore,the material of high thermal conductivity is better to use to spread heat flux, and silicon carbide is one of the candidates to make PM for CPU cooling.},
 title = {A new proposal of Peltier cooling for microprocessor},
 year = {2008}
}