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高密度半導体の実装関連材料の信頼性に関する研究
http://hdl.handle.net/10131/404
http://hdl.handle.net/10131/404821c7fc3-6a9a-4cf0-8a3d-fc42becae866
名前 / ファイル | ライセンス | アクション |
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表紙, Abstract, 概要, 目次 (42.8 kB)
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第1章 (242.5 kB)
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第2章 (1.2 MB)
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第3章 (1.1 MB)
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第4章 (1.1 MB)
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第5章 (594.0 kB)
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第6章, 公表論文一覧, 謝辞, 受賞 (34.9 kB)
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Item type | 学位論文 / Thesis or Dissertation(1) | |||||
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公開日 | 2007-03-05 | |||||
タイトル | ||||||
言語 | ja | |||||
タイトル | 高密度半導体の実装関連材料の信頼性に関する研究 | |||||
言語 | ||||||
言語 | jpn | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_db06 | |||||
資源タイプ | doctoral thesis | |||||
アクセス権 | ||||||
アクセス権 | open access | |||||
アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||
著者 |
三宅, 清
× 三宅, 清 |
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著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 21087 | |||||
姓名 | ミヤケ, キヨシ | |||||
著者別名 | ||||||
識別子Scheme | WEKO | |||||
識別子 | 21088 | |||||
姓名 | Miyake, Kiyoshi | |||||
内容記述 | ||||||
内容記述タイプ | Other | |||||
内容記述 | 横浜国立大学, 平成16年3月31日, 博士(工学), 乙第214号 | |||||
書誌情報 |
発行日 2004 |
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フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
その他のタイトル | ||||||
その他のタイトル | A study on material reliability related to high density packaging of semiconductor | |||||
国立国会図書館分類 | ||||||
主題Scheme | NDLC | |||||
主題 | UT51 |