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Ferrite and copper electroless plating of photopolymerized resin for micromolding of three-dimensional structures
http://hdl.handle.net/10131/8141
http://hdl.handle.net/10131/8141b8d813b1-3e21-4067-8262-aa2304331b43
名前 / ファイル | ライセンス | アクション |
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08pMukai_JJAP1r.pdf (913.4 kB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2012-09-14 | |||||
タイトル | ||||||
タイトル | Ferrite and copper electroless plating of photopolymerized resin for micromolding of three-dimensional structures | |||||
言語 | ||||||
言語 | eng | |||||
キーワード | ||||||
主題 | electroless plating, photopolymerization, mold, micromachine, ferrite, copper | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Mukai, Kohki
× Mukai, Kohki× Kitayama, Shinya× Yoshimura, Toshiya× Maruo, Shoji |
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著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 19886 | |||||
姓名 | ムカイ, コウキ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 19887 | |||||
姓名 | キタヤマ, シンヤ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 19888 | |||||
姓名 | ヨシムラ, トシヤ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 19889 | |||||
姓名 | マルオ, ショウジ | |||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science,Yokohama National University | ||||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science,Yokohama National University | ||||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science,Yokohama National University | ||||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science,Yokohama National University | ||||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | The electroless plating of ferrite and copper onto photopolymerized resin was investigated with the aim of fabricating three-dimensional microstructures. Evaluation by X-ray diffraction and X-ray fluorescence measurements clarified that the materials were successfully plated onto the resin mold by controlling the temperature and pH of the source solution. High-resolution optical microscope observation revealed that the 2-μm-deep pits at the surface were fully plated by the materials, demonstrating the submicron resolution of the microfabrication process. We performed the transcription of three-dimensional structures made of plated copper from a resin mold, and succeeded in the fabrication of a screw. The 40-μm-thick thread was formed accurately. | |||||
書誌情報 |
Japanese Journal of Applied Physics 巻 47, 号 4, p. 3232-3235, 発行日 2008 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 00214922 | |||||
書誌レコードID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AA12295836 | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
著者版フラグ | ||||||
出版タイプ | AM | |||||
出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||
出版者 | ||||||
出版者 | The Japan Society of Applied Physics |