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Electroless and electrolytic plating of Ni, Cu, and Co_xFe_2-xO_4 for the application of three-dimensional micro-moding
http://hdl.handle.net/10131/8023
http://hdl.handle.net/10131/8023db960c1e-014a-4703-a60e-794fde3f57c2
名前 / ファイル | ライセンス | アクション |
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08Mukai_JPST.pdf (1.1 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2012-03-26 | |||||
タイトル | ||||||
タイトル | Electroless and electrolytic plating of Ni, Cu, and Co_xFe_2-xO_4 for the application of three-dimensional micro-moding | |||||
言語 | ||||||
言語 | eng | |||||
キーワード | ||||||
主題 | electroless plating, electrolytic plating, microstructure, molding, photopolymerization | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Mukai, Kohki
× Mukai, Kohki× Kitayama, Shinya× Maruo, Shoji |
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著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18605 | |||||
姓名 | ムカイ, コウキ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18606 | |||||
姓名 | キタヤマ, シンヤ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18607 | |||||
姓名 | マルオ, ショウジ | |||||
著者別名 | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18608 | |||||
姓名 | 向井, 剛輝 | |||||
著者所属 | ||||||
Department of Solid State Materials and Engineering, Graduate School of Engineering, Yokohama National University | ||||||
著者所属 | ||||||
Department of Solid State Materials and Engineering, Graduate School of Engineering, Yokohama National University | ||||||
著者所属 | ||||||
Department of Solid State Materials and Engineering, Graduate School of Engineering, Yokohama National University | ||||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | We investigated the combination of electroless and electrolytic plating of nickel, copper, and ferrite onto photopolymerized resin for use in the molding of three-dimensional micro-structures. The micro-molding process consists of four steps: fabrication of the resinous mold via two-photon micro-polymerization, plating of the mold, electrolytic grinding to open the interior structure, and extraction. A non-conductive epoxy resin was plated with nickel, copper, or ferrite through the electroless process, and then, the second layer composed of the other material was grown by the electroless or electrolytic plating. We found that the every combination of the three materials is available. The electrolytic plating was useful for applying a thick film with high purity. | |||||
書誌情報 |
Journal of photopolymer science and technology 巻 21, 号 1, p. 53-58, 発行日 2008 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 09149244 | |||||
書誌レコードID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AA11576862 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.2494/photopolymer.21.53 | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
出版者 | ||||||
出版者 | Technical Association of Photopolymers |