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Electroless and electrolytic plating of photopolymerized resin for use in the micro-molding of three-dimensional nickel structures
http://hdl.handle.net/10131/7990
http://hdl.handle.net/10131/79900909fba6-bb9b-4444-9034-2f33655de1a3
名前 / ファイル | ライセンス | アクション |
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07Mukai_JPST.pdf (592.0 kB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2012-03-26 | |||||
タイトル | ||||||
タイトル | Electroless and electrolytic plating of photopolymerized resin for use in the micro-molding of three-dimensional nickel structures | |||||
言語 | ||||||
言語 | eng | |||||
キーワード | ||||||
主題 | electroless plating, electrolytic plating, microstructure, molding, photopolymerization, nickel | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Mukai, Kohki
× Mukai, Kohki× Yoshimura, Toshiya× Kitayama, Shinya× Maruo, Shoji |
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著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18343 | |||||
姓名 | ムカイ, コウキ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18344 | |||||
姓名 | ヨシムラ, トシヤ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18345 | |||||
姓名 | キタヤマ, シンヤ | |||||
著者(ヨミ) | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18346 | |||||
姓名 | マルオ, ショウジ | |||||
著者別名 | ||||||
識別子Scheme | WEKO | |||||
識別子 | 18347 | |||||
姓名 | 向井, 剛輝 | |||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science Graduate School of Engineering Yokohama National University | ||||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science Graduate School of Engineering Yokohama National University | ||||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science Graduate School of Engineering Yokohama National University | ||||||
著者所属 | ||||||
Department of Mechanical Engineering and Materials Science Graduate School of Engineering Yokohama National University | ||||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | We investigated the electroless and electrolytic plating of photopolymerized resin for use in the molding of three-dimensional nickel micro-structures. The micro-molding process consists of four steps: fabrication of the resin mold, electroless plating of the mold, electrolytic grinding to open the interior structure, and extraction. An epoxy resin mold, which is suitable for two-photon micro-polymerization, was successfully plated with nickel through this electroless process. Electrolytic plating was found to be useful for applying a thick nickel film on non-conductive resin with low crystal lattice distortion and few impurities. Regarding the design of the mold opening, it was shown that electroless plating does not proceed inside non-through-holes on the sub-millimeter scale, but that it proceeds inside through-holes with a diameter of 550 μm and down to the depth of 2 mm. | |||||
書誌情報 |
Journal of photopolymer science and technology 巻 20, 号 2, p. 285-290, 発行日 2007 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 09149244 | |||||
書誌レコードID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AA11576862 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.2494/photopolymer.20.285 | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
出版者 | ||||||
出版者 | Technical Association of Photopolymers |